Innenleben des Moduls 8M5T-19C112-* (Teardown)

• Function: Bluetooth, USB, CAN, CR16C RISC CPU, Internal SRAM/Flash/Boot-ROM
• Marking: NS CP3CN37VVAWQ (CP3CN37-Serie)
• Package: LQFP-144
• Datasheet: CP3CN37.pdf
• Detaillierte Informationen zur MCU vom Typ CP3CN37

Angeschlossen als externer Flash-Speicher (Flash 3) der MPU (CP3CN37). Enthält den Bootloader- und Programmcode des Moduls. Ist mit 3V Betriebsspannung direkt IO-Kompatibel mit der MPU. CE# ist über einem 33 Ohm Leitungswiderstand mit CS0 der MPU verbunden.

• Function: 16 Mbit (2 Mbyte), 3V Parallel NOR Flash Memory
• Marking: ST M29W160ET
• Package: TSOP-48
• Datasheet: M29W160E.pdf
• Manufactorer code: 0x0020
• Chip-ID: 0x22C4

• Function: External RAM of CP3CN37
• Marking: FIDELIX FMP1617CA5
• Package: BGA
• Datasheet: FMP1617CAx.pdf

• Function: Digitaler Signalprozessor (DSP)
• Marking: TMS320 VC5507ZHH
• Package: QFP
• Datasheet: TMS320VC5507.pdf

• Function: 64Mbit 3V Parallel NOR Flash Embedded Memory
• Marking: ST M29W640GL
• Package: TSOP-56
• Datasheet: M29W640G.pdf

• Function: 64Mbit SDRAM
• Marking: Samsung K4S641632N
• Package: TSOP-54
• Datasheet: K4S64xx32n.pdf

• Function: 8-Mbit (1 Mbit x 8 or 512 Kbits x 16, boot block) 3V supply flash memory
• Marking: ST M29W800DB
• Package: TSOP48
• Datasheet: M29W800D.pdf
• Features:
  • 19 memory blocks = 1 boot block (top or bottom location), 2 parameter and 16 main blocks
  • Common flash interface, 64-bit security code
  • „*DB“ = „bottom boot“ location. The 16-Kbyte boot block (0x00000 to 0x03FFF) can be used for small initialization code to start the microprocessor, the two 8-Kbyte parameter blocks (0x04000 - 0x05FFF and 0x06000 - 0x07FFF) can be used for parameter storage and the remaining 32-Kbyte is a small main block where the application may be stored.

• Function: iPod Authentication Coprocessor Chip
• Marking: V112 / AA 08K / CF6Q G4
• Package:
• Datasheet:

• Function: Low-Power Stereo CODEC with 10 Inputs, 7 Outputs, HP/Speaker Amplifier and Enhanced Digital Effects
• Marking: AIC331 TI 18W
• Package:
• Datasheet: TLV320AIC33.pdf

• Function: Single Chip Bluetooth v2.0+EDR System
• Marking: „csr / BC417 / 143BGQ“
• Package: BGA96
• Datasheet: csr-BC417.pdf

• Function: LOW-POWER DIFFERENTIAL LINE DRIVER AND RECEIVER PAIRS
• Marking: TI 6LB179 19M AELR
• Package: SO8
• Datasheet: SN65LBC179.pdf

• Function: 3.3V ABT OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
• Marking: LXH374
• Package: SO20
• Datasheet: SN54LVTH374.pdf

• Function:
• Marking: „C57 / 16Z“
• Package: SO8
• Datasheet:

• Function: Dual Power OpAmp
• Marking: 9221 ST EB132
• Package: SO8
• Datasheet: TS922.pdf

• Function: 4-Fach OpAmp
• Marking: TI L2902
• Package: SO14
• Datasheet: LM2902.pdf

• Function: High speed CAN transceiver
• Marking: NXP TJA1041
• Package: SO14
• Datasheet: TJA1041.pdf

• Function: Series of Adjustable Micropower Voltage Regulators
• Marking: NS MFAR 2951
• Package: SO8
• Datasheet: LP2951.pdf

• Function:
• Marking: BBW / 19W / Z46T (oder auf anderem Modul „BBW 86W Z267“)
• Package:
• Datasheet:

• Function: 1A Load Step-Down DC-DC Regulator
• Marking: M16AB L163B
• Package: TSOT-6 (Thin SOT23)
• Datasheet: LM2734.pdf

• Function:
• Marking: BUH TI K 62F3 (nicht gut lesbar)
• Package:
• Datasheet:

• Function: 64 Kbit Serial EEPROM (SPI)
• Marking: „564R / B134“
• Package: UDFN8
• Datasheet: GT25C64.pdf

• Function: P-Channel MOSFET
• Marking: 59* (591AF or 592AA or 59HAI…) or AS* (ASYAB…)
• Package: TSOP-6
• Datasheet: Si3459BDV.pdf

• Function:
• Marking: 2313 11GDS
• Package: SO8
• Datasheet: